Due to a bad pass, and multilayer printed circuit board structure of high density interconnect reliability will bring a series of technical problems.

- Dec 02, 2016-

Therefore, measures must be adopted to control and resolve. Mainly uses the following process:

(1) strictly control the resin coated copper foil thickness of dielectric layer when the pressure difference between 510 μ m.

(2) change the laser energy density and number of pulses (gun), test ways you can find out the production process.

(3) the hole wall thickness of adhesive residue and clean up of broken slag from malnutrition.

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