A. Substrate laminate top, is the use of resin coated copper foil, all etched copper foil is then removed and CO2 laser can be used on the bare resin surface directly into the hole, and then continue to follow the plated through hole technology for hole processing.
B. Substrate is FR-4 prepreg and to replace the resin coated copper foil copper foil method is similar to the production process.
C. Photosensitive resin coated follow-up process of laminating copper foil method.
D. Dry film as dielectric layer and pressing technology of copper foil method.
E. other types of coating temperature film and copper foil method of overburden pressure to produce.