PCB multilayer board is used for electrical products in the multi-layer circuit boards, multilayer board with more single-sided or double-panel wiring board. With a double-sided inner layer, two single-sided for the outer layer or two double-sided for the inner layer, two single-sided for the outer printed circuit board, through the positioning system and insulation bonding material alternately and conductive graphics According to the design requirements of the interconnection of the printed circuit board has become a four-story, six-layer printed circuit board, also known as multi-layer printed circuit board.
With the continuous development of SMT (Surface Mount Technology) and the introduction of new generation SMD (Surface Mount Devices), such as QFP, QFN, CSP, BGA (especially MBGA), make electronic products more intelligent and miniaturized. To promote the PCB industry, a major technological reform and progress. Since 1991, IBM has successfully developed high-density multilayer (SLC), the major groups have also developed a variety of high-density interconnect (HDI) microplates. The rapid development of these processing technology, prompted the PCB design has been gradually to the multi-layer, high-density wiring direction. Multi-layer printed circuit board with its design flexibility, stable and reliable electrical performance and superior economic performance, is now widely used in the production of electronic products.
PCB multilayer and single-panel, double-panel the biggest difference is to increase the internal power layer (to maintain the internal layer) and ground plane, power and ground network mainly in the power layer wiring. However, multi-layer board wiring is mainly to the top and bottom of the main, supplemented by the middle of the wiring layer. Therefore, the design of multi-layer board and double-panel design method is basically the same, the key is how to optimize the wiring of the inner layer, so that the circuit board wiring is more reasonable, better electromagnetic compatibility.
PCB multilayer shelf life in the IPC is defined, the surface process is antioxidant, not demolition of vacuum packaging, half a year to use finished, demolished the vacuum packaging in twenty-four hours, and is the temperature and humidity control Environment, the board is not used in the next year to use the packaging, opened within a week to be finished finished film, the same to control the temperature and humidity, gold plate equivalent tin plate, but the control process than tin plate strict.