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HAL tin lead: The deposition thickness is irregular, 1µm to 10µm. Not suitable for dense feet IC and BGA soldering, because it’s lack of flatness and uniformity. The advantage is their long storage (24 months) and the lower cost.
Material /Laminate: FR4 TG140
Board thickness: 1.2mm
Copper weight: 1/1/1/1/1/1oz
The affect of surface treatment on soldering as below,