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VIA IN PAD PCB: Vias in pad is normally to be plugged with non-conductive epoxy and then plated caps. Filling non-conductive epoxy/resin is more cheaper than filling copper. And this filling gives better result for soldering as it can avoid tin flowing into holes when assembly.
Material /Laminate: FR4 TG170
Board thickness: 1.2mm
Copper weight: 1.5/1/1/1/1/1.5oz
Via in Pad technical advantages can be divided into 2 categories. Firstly, reduce the spacing of hole to hole as well as board size. Secondly, solve the problems with the wiring conductor and improve the wiring density.
The briefly process for VIA IN PAD as beow,
material cutting→drilling→PTH→plating→non-conductive epoxy plugging→polish→drilling through hole→PTH→plating→outer layer pattern→plating→etching→solder mask→surface finish→routing→testing→FQC→package.